| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MC6630 | IC |
MOLCHIP眸芯 |
BGA |
24+ |
11900 |
|||
| HI3556RBCV200 | 存储IC |
HISILICON/海思 |
BGA |
20+ |
8080 |
|||
| FEMDNN032G-A3A55 | 存储器 |
FORESEE/江波龙 |
BGA |
23+ |
1520 |
|||
| HI3403V100 | 视频IC |
HISILCON |
BGA |
22+ |
6000 |
|||
| NVP6124B | NEXTCHIP |
QFN76 |
25+ |
2600 |
||||
| HI3536CRBCV100 | 其他电子管 |
HISILICON/海思 |
BGA |
20+ |
58000 |
|||
| HI3520DRQCV300 | 工控元件 |
HISILICON/海思 |
QFP |
20+ |
7200 |
|||
| HI3520DRQCV200 | 工控元件 |
HISILICON/海思 |
QFP |
20+ |
6000 |
|||
| HI3559ARFCV100 | HISILICON/海思 |
FPGA |
23+ |
5000 |
||||
| YT8521SH-CA | 以太网IC |
MOTORCOMM/裕太微 |
QFN |
20+ |
50060 |
|||
| HI3531ARBCV100 | HISILICON/海思 |
BGA |
20+ |
1100 |
||||
| HI3518ERBCV200 | 其他被动元件 |
HISILICON/海思 |
BGA |
19+ |
330 |
|||
| HI3516ERBCV300 | HISILICON/海思 |
BGA |
20+ |
1360 |
||||
| 22AP30 | IC |
HISILICON/海思 |
BGA |
24+ |
6600 |
|||
| HI3516ERNCV200 | HISILICON/海思 |
QFN88 |
20+ |
4050 |
||||
| HI3536RBCV100 | HISILICON/海思 |
BGA |
20+ |
2000 |
||||
| HI3520ARBCV100 | 其他设备 |
HISILICON/海思 |
BGA |
16+ |
500 |
|||
| NVP6134 | NEXTCHIP |
QFP128 |
18+ |
90000 |
||||
| NVP2020 | NEXTCHIP |
LQFP64 |
21+ |
2 |
||||
| NVP2440H | NEXTCHIP |
QFN88 |
20+ |
2600 |
商家默认展示20条库存